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Process Engineering Experience

Ray P. Delio's career has been characterized by a broadening and deepening set of technical skills and expert knowledge, encompassing especially the fields of process engineering, instrumentation, plant automation, and chemical engineering.

Significant Roles

Process Engineering Department Manager – Facilities Services & Electronics and Advanced Technology – for a Full-service Engineering Company, Pittsburgh, PA. 2006-2008: Responsible for planning of process design projects for the Fortune 100 clients of this global leader in full-service engineering, consulting, construction, and operations.

Photolithography Development Engineer – Process Engineering – for a major Microchip Fabrication Company, Fishkill, NY: 2005-2006: Responsible for advanced process engineering role with this semiconductor firm founded by Philips Electronics, helping to facilitate process discovery, development, materials and equipment selection, and managing the installation, startup and commissioning of 200µm semi-conductor tooling.

Project Manager – 200mm Factories Worldwide Process Engineering – for a globally dominant Microchip Fabrication Company, Hillsboro, OR. 2001-2005: Led the design and development of semiconductor fabrication and packaging process technologies, as well facilitating the transfer of new processes from development to high-volume factories worldwide.

Relevant Certifications & Skills

Ray is familiar with the following process standards:

  • SEMI
  • ASME B31.1 piping standards
  • NFPA

Ray is also familiar with the following tools in 200mm and 300mm manufacturing:

  • ASML
  • SVG
  • TEL
  • Nikon
  • DNS
  • SEZ
  • BioRAD
  • FSI
  • STEAG
  • LAM

Ray is also familiar with the following quality control systems:

  • Total Productive Maintenance
  • ISO 9001:2000
  • ISO 14000

Significant Projects

Program Manager

Full-service Engineering Company, NY: Responsible for a major renovation program requiring full-service Design and Construction administration services for IBM and IBM Alliance Partners – DoD, AMD, Global Foundries, SONY, NXP, Chartered, Infineon, Toshiba and Samsung – in Fishkill NY, Poughkeepsie Yorktown Heights NY, as well as Burlington, VT. Responsible for strategic and tactical operational planning, experience gained with PHA, HAZOP, or FMEA analysis, and implementation of corrective action plans.

Design Project Manager

Full-service Engineering Company East Fishkill, NY: Cooling Tower 6 – Responsible for project management to deliver replacement of a 6-cell cross flow wooden cooling tower (installed in 1985) with a new 4-cell counter-current Marley SPX 18,000 gpm cooling tower. Design required a custom cantilever reinforced concrete hydraulic basin to hold 18,000 gpm, with a sump pit for free cooling operation. The basin supporting the new tower sat on 30’ high concrete foundation piers.

Process Engineering Department Manager

Full-service Engineering Company Rio Rancho, NM: P1268 Programming – Responsible for the team for completing facility demand and capacity analysis for Process Gas, Liquid and Waste system analysis, and scope of work development, to enable the conversion of F11 and F11X from 1266 to 1268 technology. Scope of work developed from the demonstration and installation of over 600+ manufacturing tool-sets, facility main and lateral sizing, POC capacity, and cost estimates.

Design and Construction Project Manager

Full-service Engineering Company, Chandler AZ: Bulk Chemical Distribution System installation – Responsible for the engineering, procurement and process development projects for Bulk chemical distribution of Methanol, Ethanol, TMAH, NMP, DI-Water, and N2. Design compliance as required with SEMI standards, AZ building codes, OSHA 29 CFR 1910, ASME B31.1 piping standards, NFPA standards and EPA waste disposal regulations.

Design Project Manager

Full-service Engineering Company, East Fishkill NY: Site-wide Air Handler Unit Replacement Project – Responsible for project management to design for site AHU upgrade project of 150 tons mechanical room, and roof top HVAC equipment serving 1,500,000 sq. ft. of office, clean room & laboratory space.

Design Project Manager

Full-service Engineering Company, East Fishkill NY: Reliability Stress Lab – Responsible for project management to deliver the design for a 22,000 sq. ft. chip testing and reliability lab for analysis of semiconductor chips using Blue M Integrated Thermal Inline Curing Ovens and Blue M Environmental Test Chambers.

Design Project Manager

Full-service Engineering Company, Yorktown NY: High Purity Gas Supply to microelectronic factory – Responsible for project management and piping design for ammonia gas delivery system to avoid inline condensation and filter fouling.

Design Project Manager

Full-service Engineering Company, East Fishkill NY: High Purity Hydrogen Distribution – Responsible for project management to deliver the design routing and metal pipe supports for 316 stainless steel high-purity piping, and standard to ultra-high purity hydrogen. Project employed Aeronex Purifier, Mott Sintered Metal Filter and Carten high-purity valves.

Design Project Manager

Full-service Engineering Company, East Fishkill NY: HBS Tool Install – Responsible for project management to rearrange and construct a C4 mold clean area for the installation of a wet etch tool, using HEPES buffered saline and custom sump pump control panels. Special chemical containment considerations, and process liquid piping, made for a challenging design. Assisted in the design documents for P&ID’s, PLC installation drawings, networking architecture, and I&C scope of work. Provided technical assistance in selection of instrumentations & field devices, sump pump control panels.

Design Project Manager

Full-service Engineering Company, East Fishkill NY: Engineering Test Floor – Responsible for project management and cooling water piping design to install Teradyne J973 VLSI Test System and UltraFLEXTM test systems and stand-alone Teradyne test probers.

Process Design Engineer

Full-service Engineering Company, East Fishkill NY: Cooling Tower Condenser Water Treatment System – Responsible for project management and process engineering to design improvements in redundancy and operator access for a system that feeds sodium hypochlorite, sulfuric acid, inhibitors, and biocides to three 18,000 gpm cooling tower systems. Design used bundled PTFE tubing inside PVC containment pipes to transfer fluids to water header for each system. Project required upgrades to PLC and I/O to Quantum PLC with custom interfacing with GE Pacesetter pump controls. Employed radar tank levels, leak detection, local sump control panel and added 400 analog and digital I/O points and SCADA update.

Process Design Engineer

Full-service Engineering Company, East Fishkill, NY: Site Final Effluent Toxicity Engineering Study – Responsible for project management and process engineering to deliver conceptual design and cost estimating for. Study considered desalination for 105,000 gpd final-effluent discharge TDS reduction, alternate discharge point selection and upgrade of associated waste-water treatment plants, for 6 MGD site discharge and changes to manufacturing operations.

Wet Etch & Photolithography Project Manager

Major Multinational Electronics Company, East Fishkill NY: Principal engineer and project manager responsible for developing advanced wet and photo fabrication processes technologies for BiCMOS and CMOS products. Performed process discovery, definition and development, materials and equipment selection, as well as process optimization for front- and back-end lithography, and wet etch processes. Selected and installed wet etch and photolithography tool-sets. Developed Total Productive Maintenance and ISO 9001:2000 and ISO 14000 control systems. Responsible for supplier selection and incoming chemicals and material quality.

Wet Etch Development Engineer

Major Multinational Electronics Company, East Fishkill NY: Wet Etch Tool Install – Installed, commissioned and completed process development for BiCMOS and CMOS products on SEZ 304, 203 and DaVinci wet etch tools.

Photolithography Development Engineer

Major Multinational Electronics Company, East Fishkill NY: Installed, commissioned and completed process development for BiCMOS and CMOS products on TEL ACT 8, SVG 90S and ASML TWINSCAN and PAS 5500 tools, using positive and negative resists for front-end and back-end photolithography.

Photolithography & Packaging Development Project Manager

Global Microchip Fabrication Company, Chandler AZ: Principal engineer and project manager responsible for process development projects in the transfer of photolithographic, wet/dry etch, and metrology technology (developed in Chandler, AZ) to high-volume manufacturing, assembly & test sites across the corporation. Led cross-functional, continuous improvement teams to reduce the cost of unit processes (and defect density), and to improve the yield and throughput. Managed a large global multi-disciplined group of engineers and technicians, in the development of semiconductor fabrication and packaging process technology that achieved multi-million dollar savings, per annum, worldwide. Project involved development using ASML, SVG, TEL, Nikon, DNS, SEZ, BioRAD, FSI, STEAG, LAM tools in 200mm and 300mm manufacturing.

Ion Implant Process Engineer

Global Microchip Fabrication Company, Chandler AZ: Principal engineer responsible for process development projects in path-finding for implant layer resist technology. Project required extensive DOE, using SAP and JMP data analysis to reduce development time, and increase chances of first time success and DFM.

Photolithography Process Engineer

Global Microchip Fabrication Company, Chandler AZ: Developed copper and non-copper back-end packaging technology for advanced Intel microprocessor and flash products. Project included developing new copper / non-copper segregation and de-contamination protocols.

Principal engineer responsible for process development projects, in path-finding, for various polyamide and silicone based resist systems. Project required vendor analysis and selection based on balance sheet, extensive site visits, facility operations investigations and ISO compliance.

Spin-On-Glass Process Engineer

Global Microchip Fabrication Company, Chandler AZ: Principal engineer responsible for process development project in Spin-on-glass coating and removal modules. Project required extensive TEL ACT8 equipment modifications.

Photolithography Process Engineer

Global Microchip Fabrication Company, Chandler AZ: Principal engineer responsible for process development projects in risk and process tolerance analysis (FMEA & HAZOPs studies) on photolithography, reactive ion etch, wet etch, plating, annealing and diffusion, electrical test and final assembly process areas.

Engineering Program Success since 1989